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Rogers offers liquid cooling materials designed to dissipate large amounts of heat, and provide thermal management of high-power laser diodes and other heat-generating optical devices. The cooling structures are copper foil channels bonded into a tight block, with aluminum-nitride (AlN) isolation layers added for extra performance. [16] [17]
The resist material protects the copper from dissolution into the etching solution. The etched board is then cleaned. A PCB design can be mass-reproduced in a way similar to the way photographs can be mass-duplicated from film negatives using a photographic printer. FR-4 glass epoxy is the most common insulating substrate.
The 1100 series was a crude PCB material which was distilled to create the 1200 series PCB product. [ 24 ] The exception to the naming system is Aroclor 1016 which was produced by distilling 1242 to remove the highly chlorinated congeners to make a more biodegradable product. "1016" was given to this product during Monsanto's research stage for ...
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
FR-2 (Flame Resistant 2) is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards. Its main properties are similar to NEMA grade XXXP (MIL-P-3115) material, and can be substituted for the latter in many ...
Flow rates and material viscosity are programmed into the computer system, controlling the application so that the desired coating thickness is maintained. This method is effective for large volumes, provided that the PCB is designed for the method.
Phenolic paper is a material often used to make printed circuit board (PCB) substrates (the flat board to which electronic components and traces are attached). It is a very tough board made of wood fibre and phenolic polymers. It is most commonly brown in colour, and is a fibre reinforced plastic.
There are several design considerations and mitigation techniques that can be used to reduce the susceptibility to CAF. Certain material selection (i.e. laminate) and design rules (i.e. via spacing) can help reduce CAF risk. Poor adhesion between the resin and glass fibers in the PCB can create a path for CAF to occur.
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