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Rogers offers liquid cooling materials designed to dissipate large amounts of heat, and provide thermal management of high-power laser diodes and other heat-generating optical devices. The cooling structures are copper foil channels bonded into a tight block, with aluminum-nitride (AlN) isolation layers added for extra performance.
The resist material protects the copper from dissolution into the etching solution. The etched board is then cleaned. A PCB design can be mass-reproduced in a way similar to the way photographs can be mass-duplicated from film negatives using a photographic printer. FR-4 glass epoxy is the most common insulating substrate.
The 1100 series was a crude PCB material which was distilled to create the 1200 series PCB product. [ 24 ] The exception to the naming system is Aroclor 1016 which was produced by distilling 1242 to remove the highly chlorinated congeners to make a more biodegradable product. "1016" was given to this product during Monsanto's research stage for ...
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand vo
Polytetrafluoroethylene (PTFE), better known by its trade name Teflon, has many desirable properties which make it an attractive material for numerous industries. It has good chemical resistance, a low dielectric constant, low dielectric loss, and a low coefficient of friction, making it ideal for reactor linings, circuit boards, and kitchen utensils, to name a few applications.
The PCB of a quartz watch. The clock IC is under the drop of black epoxy. Chip on board (COB) is a method of circuit board manufacturing in which integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. [1]
IMI Energy Solutions at Fremont, California, USA. IMI started on August 8, 1980 as a joint venture between Ayala Corporation and Resins, Inc. With its headquarters in Muntinlupa, they were just a workforce of around 100 employees with total fixed assets of US$3,700,290 and it is engaged in the assembly of integrated circuits.
FR-2 (Flame Resistant 2) is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards. Its main properties are similar to NEMA grade XXXP (MIL-P-3115) material, and can be substituted for the latter in many ...