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A silversmith hard soldering of silver rings using flux and silver solder wire. "Hard soldering" or "silver soldering" is used to join precious and semi-precious metals such as gold, silver, brass, and copper. The solder is usually described as easy, medium, or hard in reference to its melting temperature, not the strength of the joint. Extra ...
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties.
Silver brazing may cause defects in certain alloys, e.g. stress-induced inter-granular cracking in copper-nickel. One special silver brazing method is called pinbrazing or pin brazing. It has been developed especially for connecting cables to railway track or for cathodic protection installations. The method uses a silver- and flux-containing ...
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Silver whiskers growing out of surface-mount resistors Metal whiskering is a phenomenon that occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century in equipment that used pure, or almost pure, tin solder in ...
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
There are three basic techniques that may be used to attach granules to a metal surface: hard soldering, fusing and colloidal soldering. The metals used in granulation are usually gold and/or silver alloys of high purity – alloys below 18 kt. gold and sterling silver being unsuitable. With each technique, the process begins with the making of ...