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Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...
where t is the depth of cut, P is the laser beam power, v is the cutting velocity, and d is the laser beam spot diameter. [5] The depth of the cut is also influenced by the workpiece material. The material's reflectivity, density, specific heat, and melting point temperature all contribute to the lasers ability to cut the workpiece.
William Osman (born June 8, 1991) is an American YouTuber and engineer based in Ventura, California.He makes videos about science and robots. He has gone viral for a 2017 video featuring a laser cut sculpture of Vin Diesel made of a ham and cheese sandwich and a 2021 video featuring a homemade X-ray machine.
Laser marking on stainless steel A laser engraving machine A laser engraver. A laser engraving machine consists of three main parts: a laser, a controller, and a surface. [2] The laser is a drawing tool: the beam emitted from it allows the controller to trace patterns onto the surface.
The word laser originated as an acronym for light amplification by stimulated emission of radiation. [1] [2] The first laser was built in 1960 by Theodore Maiman at Hughes Research Laboratories, based on theoretical work by Charles H. Townes and Arthur Leonard Schawlow and the optical amplifier patented by Gordon Gould. [3] [4] [5]
Laser ablation or photoablation (also called laser blasting [1] [2] [3]) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates .
Laser beam welding (LBW) is a welding technique used to join pieces of metal or thermoplastics through the use of a laser. The beam provides a concentrated heat source, allowing for narrow, deep welds and high welding rates.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.