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Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.
Thermal paste: Mostly used in the electronics industry, thermal pastes provide a very thin bond line and therefore a very small thermal resistance. They have no mechanical strength (other than the surface tension of the paste and the resulting adhesive effect) and require an external mechanical fixation mechanism.
Thermal pads are relatively firm at room temperature, but become soft and are able to fill gaps at higher temperatures. [1] Some, but not all, types of chip carriers include thermal pads in their design. It is an alternative to thermal paste to be used as thermal interface material.
Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).
These thermal greases have low electrical conductivity and their volume resistivities are 1.5⋅10 15, 1.8⋅10 11, and 9.9⋅10 9 Ω⋅cm for 860, 8616 and 8617 respectively. The thermal grease 860 is a silicone oil with a Zinc Oxide filler and 8616 and 8617 are synthetic oils with various fillers including Aluminum Oxide and Boron Nitride.
Thermal pastes which are typically used on heat spreaders for CPUs and other chips may require replacement with a different compound in order to avoid the thermal degradation within the dielectric liquid. [5] Depending on the type of application, solder, Indium foil, and thermally conductive epoxies may be used as a replacement materials.
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
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