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  2. List of Intel chipsets - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_chipsets

    Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).

  3. DDR5 SDRAM - Wikipedia

    en.wikipedia.org/wiki/DDR5_SDRAM

    Double Data Rate 5 Synchronous Dynamic Random-Access Memory (DDR5 SDRAM) is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM , DDR5 was planned to reduce power consumption, while doubling bandwidth . [ 5 ]

  4. LGA 1200 - Wikipedia

    en.wikipedia.org/wiki/LGA_1200

    Z590 W580; Overclocking: No RAM only No Yes RAM only Bus Interface DMI 3.0 x4 DMI 3.0 x8 (runs in x4 mode for Comet Lake-S CPUs) CPU support Comet Lake-S / Rocket Lake: Rocket Lake: Maximum DIMM slots 2 4 Maximum USB 2.0 ports 10 12 14 USB 3.2 ports configuration Gen 1x1 Up to 4 Up to 6 Up to 8 Up to 10 Up to 10 Gen 2 x1 — Up to 4 Up to 8 x2 ...

  5. Memory module - Wikipedia

    en.wikipedia.org/wiki/Memory_module

    Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted. [1] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were ...

  6. GDDR5 SDRAM - Wikipedia

    en.wikipedia.org/wiki/GDDR5_SDRAM

    On February 20, 2013, it was announced that the PlayStation 4 would use sixteen 4 Gb GDDR5 memory chips for a total of 8 GB of GDDR5 @ 176 Gbit/s (CK 1.375 GHz and WCK 2.75 GHz) as combined system and graphics RAM for use with its AMD-powered system on a chip comprising 8 Jaguar cores, 1152 GCN shader processors and AMD TrueAudio. [16]

  7. CAMM (memory module) - Wikipedia

    en.wikipedia.org/wiki/CAMM_(memory_module)

    Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]

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