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Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted. [1] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were ...
The MMU was mostly compatible with the external 68851 that would be used with the 68020, [3] but being internal allowed it to access memory one cycle faster than a 68020/68851 combo. The 68030 did not include a built-in floating-point unit (FPU), and was generally used with the 68881 and the faster 68882 .
A Fully Buffered DIMM (FB-DIMM) is a type of memory module used in computer systems. It is designed to improve memory performance and capacity by allowing multiple memory modules to be each connected to the memory controller using a serial interface, rather than a parallel one.
Rambus's RDRAM saw use in two video game consoles, beginning in 1996 with the Nintendo 64. The Nintendo console used 4 MB RDRAM running with a 500 MHz clock on a 9-bit bus, providing 500 MB/s bandwidth. RDRAM allowed N64 to be equipped with a large amount of memory bandwidth while maintaining a lower cost due to design simplicity.
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
A row data buffer may be from 32 to 4096 bytes long, depending on the type of memory. Rows larger than 32 bytes ignore some of the low-order address bits in the Activate command. Rows smaller than 4096 bytes ignore some of the high-order address bits in the Read command. Non-volatile memory does not support the Write command to row data buffers.
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An outline drawing of a Type I TSOP with 32 leads. Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.