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A DIMM (Dual In-Line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM chips and pins . [ 1 ] The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards , although there are proprietary DIMMs.
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted. [1] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were ...
The SPARCstation IPX has four 72-pin SIMM slots for memory expansion. The memory uses parity Fast Page Memory (FPM) SIMM's with speeds of 50-80 ns. Slots can be filled individually giving a maximum of 64 MB memory. Paired memory modules decrease access times via "bank interleaving" resulting in faster memory and overall system performance.
A high-capacity DIMM might have numerous memory chips, each of which must receive the memory address, and their combined input capacitance limits the speed at which the memory bus can operate. By redistributing the command and address signals within the R-DIMM, this allows more chips to be connected to the memory bus. [7]
(memory density) This is the total memory capacity of the chip. Example: 128 Mib. (memory depth) × (memory width) Memory depth is the memory density divided by memory width. Example: for a memory chip with 128 Mib capacity and 8-bit wide data bus, it can be specified as: 16 Meg × 8. Sometimes the "Mi" is dropped, as in 16×8.
CFexpress is a standard for removable media cards proposed by the CompactFlash Association (CFA). The standard uses the NVM Express protocol over a PCIe 3.0 interface with 1 to 4 lanes where 1 GB/s data can be provided per lane.
As with earlier memory generations, faster DDR3 memory became available after the release of the initial versions. DDR3-2000 memory with 9-9-9-28 latency (9 ns) was available in time to coincide with the Intel Core i7 release in late 2008, [ 19 ] while later developments made DDR3-2400 widely available (with CL 9–12 cycles = 7.5–10 ns), and ...
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