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  2. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Another manufacturing process adds vias, drilled holes that allow electrical interconnections between conductive layers. Printed circuit boards are used in nearly all electronic products. Alternatives to PCBs include wire wrap and point-to-point construction, both once popular but now rarely used. PCBs require additional design effort to lay ...

  3. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    The basic steps of making a PCB are: making the substrate material and stacking it in layers; through-drilling of plating the vias; and copper trace patterning using photolithography and etching. With this standard procedure, possible via configurations are limited to through-holes.

  4. Printed circuit board milling - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board_milling

    A milled printed circuit board. Printed circuit board milling (also: isolation milling) is the milling process used for removing areas of copper from a sheet of printed circuit board (PCB) material to recreate the pads, signal traces and structures according to patterns from a digital circuit board plan known as a layout file. [1]

  5. Component placement - Wikipedia

    en.wikipedia.org/wiki/Component_placement

    Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...

  6. Depaneling - Wikipedia

    en.wikipedia.org/wiki/Depaneling

    Four-PCB panel. Depaneling or depanelization is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often arranged in a process called panelization so that they consist of many smaller individual PCBs that will be used in the final product.

  7. Routing (electronic design automation) - Wikipedia

    en.wikipedia.org/wiki/Routing_(electronic_design...

    In electronic design, wire routing, commonly called simply routing, is a step in the design of printed circuit boards (PCBs) and integrated circuits (ICs). It builds on a preceding step, called placement , which determines the location of each active element of an IC or component on a PCB.

  8. Microvia - Wikipedia

    en.wikipedia.org/wiki/Microvia

    The HDI layers are built on both sides of the traditional PCB one by one with microvias. The SBU process consists of several steps: layer lamination, via formation, via metallization, and via filling. There are multiple choices of materials and/or technologies for each step. [3] Microvias can be filled with different materials and processes: [4]

  9. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.

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