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Common features of Ryzen 3000 notebook APUs: Socket: FP5. All the CPUs support DDR4-2400 in dual-channel mode. L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 12 PCIe 3.0 lanes. Includes integrated GCN 5th generation GPU. Fabrication process: GlobalFoundries 14LP.
Matisse Ryzen 3000 series (desktop) Castle Peak Ryzen Threadripper 3000 series (desktop) Renoir Ryzen 4000 APU series with RX Vega (desktop & laptop) Lucienne Ryzen 5000 APU series (laptop) Mendocino Ryzen 7020 APU series (laptop) and Athlon 7020 APU series (laptop) Rome Epyc 7002 series (server) Zen 3 series CPUs and APUs (released 2020)
Common features of Ryzen 3000 desktop CPUs: Socket: AM4. All the CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF.
EPYC Embedded 3051 series Yes 1900–2700 (2450–3100 all) (2900–3100 boost) 16–32 MB (8 MB per CCX) Great Horned Owl Ryzen Embedded V1000 series 2/4 Yes 2000–3350 (3200–3800 boost) 4 MB Socket FP5: April 2019: Banded Kestrel Ryzen Embedded R1000 series 2 No 1200 (2600 boost) Single-channel DDR4: Yes 1500–2600 (2800–3500 boost)
Common features of Ryzen 3000 desktop APUs: Socket: AM4. All the CPUs support DDR4-2933 in dual-channel mode. L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. Includes integrated GCN 5th generation GPU.
Common features of Ryzen 3000 HEDT/workstation CPUs: Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO). Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core.
Mobile Sempron single-core 64-bit processor (codenamed Huron), with the following: 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1" low voltage processors; Mobile chipset AMD RS690E series chipset + SB600 southbridge. Mobility Radeon HD 3000 series GPU on 55 nm process (as option) DDR2 SO-DIMM; Mobile support
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