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A worst-case circuit analysis should be performed on all circuitry that is safety and financially critical. Worst-case circuit analysis is an analysis technique which, by accounting for component variability, determines the circuit performance under a worst-case scenario (under extreme environmental or operating conditions).
While in-circuit test is a very powerful tool for testing PCBs, it has these limitations: Parallel components can often only be tested as one component if the components are of the same type (i.e. two resistors); though different components in parallel may be testable using a sequence of different tests - e.g. a DC voltage measurement versus a measurement of AC injection current at a node.
[1] [2] Printed wiring boards (PWBs) and electronic components and their solder joints are common cross sectioned samples. The features of interest to be analyzed in cross section can be nanometer-scale metal and dielectric layers in semiconductors [ 3 ] up to macroscopic features such as the amount of solder that has filled into a large, 0 ...
Automatic test equipment diagnostics is the part of an ATE test that determines the faulty components. ATE tests perform two basic functions. The first is to test whether or not the Device Under Test is working correctly. The second is when the DUT is not working correctly, to diagnose the reason.
An electronic component is any basic discrete electronic device or physical entity part of an electronic system used to affect electrons or their associated fields. Electronic components are mostly industrial products , available in a singular form and are not to be confused with electrical elements , which are conceptual abstractions ...
A component selected for testing is a Unit Under Test (UUT). Operational Safety, Suitability, and Effectiveness (OSS&E) policy and instructions require consistency in the disciplined engineering process used to ensure that activities such as maintenance repairs and part substitutions do not degrade system or end-item baselined characteristics ...
EIA/TIA-455-87B FOTP-87 Fiber Optic Cable Knot Test; EIA/TIA-455-188 FOTP-188 Low Temperature Testing of Fiber Optic Components; EIA-476 Date Code Marking; EIA-RS-481 Taping/Leadless Components for Automatic Placement; RS-485 Electrical Characteristics of Generators and Receivers for Use in Balanced Digital Multipoint Systems (serial data ...
IEC TR 62240 Process management for avionics – Electronic components capability in operation; IEC 62241 Nuclear power plants – Main control room – Alarm functions and presentation; IEC 62243 Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)
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