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Core Ultra 200H and 200HX series mobile processors will follow in early 2025. [2] Arrow Lake desktop CPUs integrated Thunderbolt 4 and USB4 in the CPU, which allowed it to not waste PCIe 3 lanes and use simple retimers instead. The chipset has the same maximum 5 integrated USB 3.2 2x2, and is Thunderbolt 5 ready if discrete board is used. [3]
Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
The HX processors are desktop processors repurposed for mobile use, ... 14700K: 12 (12) 3.4 2.5 5.5 4.3 5.6 ... CPUs support 2-channel DDR5-4800 ECC memory;
Rambus announced a working DDR5 dual in-line memory module (DIMM) in September 2017. [9] [10] On November 15, 2018, SK Hynix announced completion of its first DDR5 RAM chip; running at 5.2 GT/s at 1.1 V. [11] In February 2019, SK Hynix announced a 6.4 GT/s chip, the highest speed specified by the preliminary DDR5 standard. [12]
The revealed socket Contacts of the Intel Core 9 Ultra 285K (left; LGA 1851), and i9-14900K (right, Socket 1700). LGA 1851 (codename Socket V1) is a land grid array CPU socket designed by Intel for Meteor Lake-PS and Arrow Lake-S desktop processors, released in October 24, 2024.
Apple Inc. (ARM-based CPUs) Broadcom Inc. (ARM-based, e.g. for Raspberry Pi) Fujitsu (its ARM-based CPU used in top supercomputer, still also sells its SPARC-based servers) Hitachi (its own designs and ARM) Hygon Information Technology (x86-based) Loongson (MIPS-based) HiSilicon (acquired by Huawei), stopped making its ARM-based design
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