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A via, sometimes called PTV or plated-through-via, should not be confused with a plated through hole (PTH). A via is used as an interconnection between copper layers on a PCB while the PTH is generally made larger than vias and is used as a plated hole for acceptance of component leads - such as non-SMT resistors, capacitors, and DIP package IC.
Structural integrity may be compromised, e.g., by misalignment during drilling, so that too much copper may be removed by the drill hole in the area where a trace connects to the pad or via. [2] [3] [5] An extra advantage is the enlarging of manufacturing tolerances, making manufacturing easier and cheaper. [3]
Buried microvias are required to be filled, while blind microvias on the external layers usually do not have any fill requirements. [5] A stacked microvia is usually filled with electroplated copper to make electrical interconnections between multiple HDI layers and provide structural support for the outer level(s) of the microvia or for a ...
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In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
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Copper pour on a printed circuit board flowing around tracks and pads. Copper pour is sometimes filled using a hatch fill style. In electronics, the term copper pour refers to an area on a printed circuit board filled with copper (the metal used to make connections in printed circuit boards).
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