Search results
Results from the WOW.Com Content Network
Eutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer that can produce a eutectic system. Those eutectic metals are alloys that transform directly from solid to liquid state, or vice versa from liquid to solid state, at a specific composition and temperature without ...
In the real world, eutectic properties can be used to advantage in such processes as eutectic bonding, where silicon chips are bonded to gold-plated substrates with ultrasound, and eutectic alloys prove valuable in such diverse applications as soldering, brazing, metal casting, electrical protection, fire sprinkler systems, and nontoxic mercury ...
Similar mechanical properties with Sn 63 Pb 37, Sn 62 Pb 36 Ag 2 and Sn 60 Pb 40, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C. Sn 86.9 In 10 Ag 3.1: 204: 205 [48] Yes: Potential use in flip-chip assembly, no issues with tin-indium eutectic phase. In 97 Ag 3: 143 [49] Yes: Yes
Non-eutectic compositions on cooling start to first precipitate the non-eutectic phase; dendrites when it is a metal, large crystals when it is an intermetallic compound. Such a mixture of solid particles in a molten eutectic is referred to as a mushy state. Even a relatively small proportion of solids in the liquid can dramatically lower its ...
The exact properties depend on whether the composition of the alloy is above, near or below the eutectic point. Castability increases with increasing Si content and is best at about 17% Si; the mechanical properties are best at 6% to 12% Si. The mold filling capacity reaches its maximum at 12% Si, but is also good with other contents.
NaK containing 40% to 90% potassium by mass is liquid at room temperature.The eutectic mixture consists of 77% potassium and 23% sodium by mass (NaK-77), and it is a liquid from −12.6 to 785 °C (9.3 to 1,445.0 °F), and has a density of 0.866 g/cm 3 at 21 °C (70 °F) and 0.855 g/cm 3 at 100 °C (212 °F), making it less dense than water. [3]
Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!
A eutectic formulation has advantages when applied to soldering: the liquidus and solidus temperatures are the same, so there is no plastic phase, and it has the lowest possible melting point. Having the lowest possible melting point minimizes heat stress on electronic components during soldering.