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  2. Lapping - Wikipedia

    en.wikipedia.org/wiki/Lapping

    Lapping. Lapping machine. Lapping is a machining process in which two surfaces are rubbed together with an abrasive between them, by hand movement or using a machine. Lapping often follows other subtractive processes with more aggressive material removal as a first step, such as milling and/or grinding. Lapping can take two forms.

  3. Honing (metalworking) - Wikipedia

    en.wikipedia.org/wiki/Honing_(metalworking)

    Honing is an abrasive machining process that produces a precision surface on a metal workpiece by scrubbing an abrasive grinding stone or grinding wheel against it along a controlled path. Honing is primarily used to improve the geometric form of a surface, but can also improve the surface finish. Typical applications are the finishing of ...

  4. Superfinishing - Wikipedia

    en.wikipedia.org/wiki/Superfinishing

    Superfinishing, also known as microfinishing [1] and short-stroke honing, is a metalworking process that improves surface finish and workpiece geometry. This is achieved by removing just the thin amorphous surface layer of fragmented or smeared metal left by the last process with an abrasive stone or tape; this layer is usually about 1 μm in magnitude.

  5. Surface finish - Wikipedia

    en.wikipedia.org/wiki/Surface_finish

    Surface finish. Surface finish, also known as surface texture or surface topography, is the nature of a surface as defined by the three characteristics of lay, surface roughness, and waviness. [1] It comprises the small, local deviations of a surface from the perfectly flat ideal (a true plane). Surface texture is one of the important factors ...

  6. Abrasive flow machining - Wikipedia

    en.wikipedia.org/wiki/Abrasive_flow_machining

    Abrasive flow machining. Abrasive flow machining (AFM), also known as abrasive flow deburring[1] or extrude honing, [2] is an interior surface finishing process characterized by flowing an abrasive -laden fluid through a workpiece. [1][3][2] This fluid is typically very viscous, having the consistency of putty, [2][3] or dough. [1]

  7. Wafer backgrinding - Wikipedia

    en.wikipedia.org/wiki/Wafer_backgrinding

    Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps. The silicon wafers predominantly used today have diameters of 200 and 300 mm.

  8. Flat honing - Wikipedia

    en.wikipedia.org/wiki/Flat_honing

    Flat honing. A flat honing machine. Flat honing is a metalworking grinding process used to provide high quality flat surfaces. It combines the speed of grinding or honing with the precision of lapping. It has also been known under the terms high speed lapping and high precision grinding. [1]

  9. Abrasive machining - Wikipedia

    en.wikipedia.org/wiki/Abrasive_machining

    Abrasive machining. Abrasive machining is a machining process where material is removed from a workpiece using a multitude of small abrasive particles. Common examples include grinding, honing, and polishing. Abrasive processes are usually expensive, but capable of tighter tolerances and better surface finish than other machining processes.