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An (orange-epoxy) encapsulated hybrid circuit on a printed circuit board (PCB).. A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors ...
electronic design automation A system in which a computer provides assistance to the designer of a device or system. electronic engineering The profession of applying electronics to practical problems. electronic filter A filter that alters some frequency-related characteristic of a signal. electronics
A transparent plastic housing around an electronic device. In engineering, a housing or enclosure is a container, a protective exterior (e.g. shell) or an enclosing structural element (e.g. chassis or exoskeleton) designed to enable easier handling, provide attachment points for internal mechanisms (e.g. mounting brackets for electrical components, cables and pipings), maintain cleanliness of ...
semiconductor – a material with an electrical conductivity value falling between that of a conductor and an insulator; its resistivity falls as its temperature rises; silicon – the semiconductor material used most frequently as a substrate in electronics; silicon on insulator (SoI) – a layered silicon–insulator–silicon substrate
In Electrical Engineering, the process of circuit design can cover systems ranging from complex electronic systems down to the individual transistors within an integrated circuit. One person can often do the design process without needing a planned or structured design process for simple circuits.
Chemists can design these compounds on a molecular scale with highly sophisticated methods and the resulting systems are used for the formation of functional hybrid materials. Many future applications, in particular in nanotechnology, focus on a bottom-up approach in which complex structures are hierarchically formed by these small building blocks.
In integrated circuit (IC) design, a via is a small opening in an insulating oxide layer that allows a conductive connection between different layers. A via on an integrated circuit that passes completely through a silicon wafer or die is called a through-chip via or through-silicon via (TSV).
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .