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A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, [1][2] so that they behave as a single device to achieve performance ...
The maximum electrical conductance of a single-walled carbon nanotube is 2G 0, where G 0 = 2e 2 /h is the conductance of a single ballistic quantum channel. [ 61 ] Because of the role of the π-electron system in determining the electronic properties of graphene , doping in carbon nanotubes differs from that of bulk crystalline semiconductors ...
Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones ...
Through-silicon via. In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
Lift Top Coffee Table. Found: the lift-top coffee table of your dreams. Coming in at less than $200, this multi-functional piece (which comes in five colors, as well as a slighter larger size ...
Pseudocapacitors were named for their ability to store electric energy electro-chemically with reversible faradaic charge-transfer. Hybrid capacitors combine double-layer and pseudocapacitors to increase power density. Silver mica, glass, silicon, air-gap and vacuum capacitors are named for their dielectric.
The Panasonic Lumix DMC-G85/G80 (DMC-G81 in Germany) is a mid-level DSLR-styled Micro Four Thirds mirrorless camera announced on September 19, 2016. The follow-up to the Panasonic Lumix DMC-G7, its main improvements are a weather-sealed body, an upgraded electronic viewfinder, no recording limit (Only G85, USA version) and the addition of 5-axis in-body image stabilization which works together ...
Figure 3 (Ref. needed) shows a schematic of a vibration isolation system consisting of a weighted platform supported by a single six-DOF isolator incorporating the isolators of Figures 1 and 2 (Figures 1 and 2 are missing). Flexures are used in place of the hinged bars shown in Figure 1. A tilt flexure serves as the tilt-motion isolator.
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