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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.

3. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints becomes more of a concern as less and less solder is allowed for each joint. Voiding is a fault commonly associated with solder joints, especially when reflowing a solder paste in the SMT application.

4. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Dispensed solder paste on the pads of a QFPs Mask and spheres for reballing. Heating a single SMD with a hot-air gun to melt all solder joints between it and the PCB is usually the first step, followed by removing the SMD while the solder is molten. The pad array on the conductor board should then be cleaned of old solder.

5. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   Ideally, a solder paste should have, at minimum, a 4-hour stencil life. The stencil life is defined as a time period in which there will be no significant change in the solder paste material characteristics. A solder paste with a longer stencil life will be more robust in the printing process.

6. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

7. Flat no-leads package - Wikipedia

   en.wikipedia.org/wiki/Flat_no-leads_package

   Some key QFN design considerations are pad and stencil design. When it comes to bond pad design two approaches can be taken: solder mask defined (SMD) or non-solder mask defined (NSMD). A NSMD approach typically leads to more reliable joints, since the solder is able to bond to both the top and sides of the copper pad. [4]