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The largest volume type of circuit board—an "FR-4 board"—is a sandwich of layers of glass cloth bonded into a composite by an epoxy resin. Epoxy resins are used to bond copper foil to circuit board substrates, and are a component of the solder mask on many circuit boards. Flexible epoxy resins are used for potting transformers and inductors ...
[12] [13] From the 1990s onward, concern has been raised over the use of BADGE-based epoxy resins in the lining of some cans for foodstuffs, with the chemical being found to leach into foods. [ 12 ] [ 14 ] Bisphenol A Diglycidyl ether-based epoxy coatings are extensively used for coating the inside of cans which come into contact with food and ...
[9] [10] The manufacturing of epoxy resins and vinyl ester resins account for 25–30% of BPA use. [9] [10] The remaining 5% is used as a major component of several high-performance plastics, and as a minor additive in PVC, polyurethane, thermal paper, and several other materials. It is not a plasticizer, [11] although it is often wrongly ...
Epoxy resins can be categorized into three distinct types based on the chemical structure of their resin backbone: aliphatic, cycloaliphatic, and aromatic epoxy resins. [4] An increase in the molecular length between reactive epoxy groups results in a reduction of crosslink density and resin modulus, while simultaneously enhancing the failure ...
The epoxy value is defined as the number of moles of epoxy group per 100g resin. So as an example using an epoxy resin with molar mass of 382 and that has 2 moles of epoxy groups per mole of resin, the EEW = 382/2 = 191, and the epoxy value is calculated as follows: 100/191 = 0.53 (i.e. the epoxy value of the resin is 0.53). [6]
The bisphenols (/ ˈ b ɪ s f ɪ n ɒ l /) are a group of industrial chemical compounds related to diphenylmethane; commonly used in the creation of plastics and epoxy resins. [1] [2] [3] Most are based on two hydroxyphenyl functional groups linked by a methylene bridge.
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