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There are several types of gold plating used in the electronics industry: [3] Soft, pure gold plating is used in the semiconductor industry. The gold layer is easily soldered and wire bonded. Its Knoop hardness ranges between 60 and 85. The plating baths have to be kept free of contamination. Soft, pure gold is deposited from special electrolytes.
The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni 2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG. [1]
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Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...
The boron or phosphorus contents was claimed to be variable from 0.1 to 12%, and that of thallium from 0.5 to 6%. The coatings were claimed to be "an intimate dispersion of hard trinickel boride (Ni 3 B) or nickel phosphide (Ni 3 P) in a soft matrix of nickel and thallium". [13]
A surface plating of blue gold on karat gold or sterling silver can be achieved by a gold plating of the surface, followed by indium plating, with layer thickness matching the 1:2 atomic ratio. A heat treatment then causes interdiffusion of the metals and formation of the required intermetallic compound.
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The gold-tin intermetallics layer is responsible for poor mechanical reliability of tin-soldered gold-plated surfaces where the gold plating did not completely dissolve in the solder. Two processes play a role in a solder joint formation: interaction between the substrate and molten solder, and solid-state growth of intermetallic compounds.
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