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Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...
This method is now commonly called the metal assisted chemical etching of silicon. Other semiconductors were also successfully etched with MACE, such as silicon carbide [4] or gallium nitride. [5] However, the main portion of research is dedicated to MACE of silicon.
Hardmask materials can be metal or dielectric. Silicon based masks such as silicon dioxide or silicon carbide are usually used for etching low-κ dielectrics. [3] However, SiOCH (carbon doped hydrogenated silicon oxide), a material used to insulate copper interconnects, [4] requires an etchant that
Most commonly, dry chlorine treatment is used to selectively etch metal or metalloid atoms from the carbide precursor lattice. [1] The term "chlorine treatment" is to be preferred over chlorination as the chlorinated product, metal chloride, is the discarded byproduct and the carbon itself remains largely unreacted.
Advanced Silicon Etching (ASE) is a deep reactive-ion etching (DRIE) technique to etch deep and high aspect ratio structures in silicon. ASE was created by Surface Technology Systems Plc (STS) in 1994 in the UK. STS has continued to develop this process with faster etch rates.
Silicon carbide (SiC), also known as carborundum (/ ˌ k ɑːr b ə ˈ r ʌ n d əm /), is a hard chemical compound containing silicon and carbon. A wide bandgap semiconductor , it occurs in nature as the extremely rare mineral moissanite , but has been mass-produced as a powder and crystal since 1893 for use as an abrasive .
Carborundum etching (sometimes called carbograph printing) was invented in the mid-20th century by American artists who worked for the WPA. [17] In this technique, a metal plate is first covered with silicon carbide grit and run through an etching press; then a design is drawn on the roughened plate using an acid-resistant medium. After ...
Dry etching is particularly useful for materials and semiconductors which are chemically resistant and could not be wet etched, such as silicon carbide or gallium nitride. Low density plasma (LDP) is able to produce high energy reactions at a low energy cost in thanks to its low pressure, meaning dry etch requires a relatively small quantity of ...