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  2. Hot-melt adhesive - Wikipedia

    en.wikipedia.org/wiki/Hot-melt_adhesive

    The bonding temperature is lower than with most other HMAs, only about 50 °C (122 °F) to 70 °C (158 °F), when the adhesive behaves as a soft rubber acting as a pressure-sensitive adhesive. The surface wetting in this amorphous state is good, and on cooling the polymer crystallizes, forming a strong flexible bond with high cohesion.

  3. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    2. Typically, thermocompression bonds are made with delivering heat and pressure to the mating surface by a hard faced bonding tool. Compliant bonding [11] is a unique method of forming this type of solid state bond between a gold lead and a gold surface since heat and pressure is transmitted through a compliant or deformable media. The use of ...

  4. Cricut - Wikipedia

    en.wikipedia.org/wiki/Cricut

    The original Cricut machine has cutting mats of 150 mm × 300 mm (6 in × 12 in), the larger Cricut Explore allows mats of 300 mm × 300 mm, and 300 mm × 610 mm (12 in × 12 in, and 12 in × 24 in). The largest machine will produce letters from a 13 to 597 mm (0.5 to 23.5 in) high.

  5. Metallic bonding - Wikipedia

    en.wikipedia.org/wiki/Metallic_bonding

    The strong bonding of metals in liquid form demonstrates that the energy of a metallic bond is not highly dependent on the direction of the bond; this lack of bond directionality is a direct consequence of electron delocalization, and is best understood in contrast to the directional bonding of covalent bonds.

  6. Ironing - Wikipedia

    en.wikipedia.org/wiki/Ironing

    Ironing is the use of an iron, usually heated, to remove wrinkles and unwanted creases from fabric. [1] The heating is commonly done to a temperature of 180–220 °C (360–430 °F), depending on the fabric. [2] Ironing works by loosening the bonds between the long-chain polymer molecules in the fibres of the material. While the molecules are ...

  7. Thermal decomposition - Wikipedia

    en.wikipedia.org/wiki/Thermal_decomposition

    This is because stronger bonds form between atoms towards the top of the reactivity series, and strong bonds are difficult to break. For example, copper is near the bottom of the reactivity series, and copper sulfate (CuSO 4 ), begins to decompose at about 200 °C (473 K; 392 °F), increasing rapidly at higher temperatures to about 560 °C (833 ...

  8. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    There are three major requirements of creating a desirable surface for adhesive bonding of plastics: the weak boundary layer of the given material must be removed or chemically modified to create a strong boundary layer; the surface energy of the adherend should be higher than the surface energy of the adhesive for good wetting; and the surface profile can be improved to provide mechanical ...

  9. Bond energy - Wikipedia

    en.wikipedia.org/wiki/Bond_energy

    It is sometimes called the mean bond, bond enthalpy, average bond enthalpy, or bond strength. [ 1 ] [ 2 ] [ 3 ] IUPAC defines bond energy as the average value of the gas-phase bond-dissociation energy (usually at a temperature of 298.15 K) for all bonds of the same type within the same chemical species.

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