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Dye-n-Pry, also called Dye And Pry, Dye and Pull, Dye Staining, or Dye Penetrant, is a destructive analysis technique used on surface mount technology (SMT) components to either perform failure analysis or inspect for solder joint integrity.
USB Tweezers performing cold bump pull (CPB) on a bond tester. Measuring bond strength by pull testing is often the best way to get the failure mode in which you are interested. Additionally, and unlike a shear test, as the bond separates, the fracture surfaces are pulled away from each other, cleanly enabling accurate failure mode analysis.
A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.
A bond tester is a scientific instrument used to measure the mechanical strength of bonds, evaluate bond strength distributions or determine compliance with specified bond strength requirements of the applicable acquisition document.
The Mk 10 would hold a depth about 4 - 6 feet lower than the setting because the testing on the calibration was not done with the WAR HEAD installed (not wanting to risk blowing up something that was worth more than a four bedroom family home at the time.
The prototype exploder was fitted to a Mark 10 torpedo and test-fired in Narragansett Bay on 8 May 1926; the submarine USS L-8 was the target. [12] In the first test, the torpedo ran underneath the target submarine but did not explode; a second test was successful. Those two shots were the only live-fire tests until World War II.
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