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Research Institute Germany: Fraunhofer Institute for Microelectronic Circuits and Systems (IMS) MEMS design & process development, Fraunhofer focus location for specialized MEMS-processes Silicon, SOI. Proof-of-concept, Prototyping, small volume production 8 Research Institute Germany: Hanking Electronics
Multi-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share tooling (like mask) and microelectronics wafer fabrication cost between several designs or projects. MPC consisting of five CMOS IC designs and few test N- and PMOS transistors for manufacturing acceptance
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
MOSIS (Metal Oxide Semiconductor Implementation Service) is multi-project wafer service that provides metal–oxide–semiconductor (MOS) chip design tools and related services that enable universities, government agencies, research institutes and businesses to prototype chips efficiently and cost-effectively.
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
This is an accepted version of this page This is the latest accepted revision, reviewed on 3 January 2025. American semiconductor equipment company Lam Research Corporation Company type Public Traded as Nasdaq: LRCX Nasdaq-100 component S&P 500 component Industry Semiconductors Founded 1980 ; 45 years ago (1980) Founder David K. Lam Headquarters Fremont, California, U.S. Key people Tim Archer ...
Module 2 was originally named "(AMD) Fab 30" and was a 200 mm fab producing 30,000 Wafer Outs Per Month, but has now been converted into a 300 mm wafer fab. [62] Together with other clean room extensions like the Annex they have a maximum full capacity of 80,000 of 300 mm wafers/month (180,000 200 mm wafers/month equivalent), using technologies ...
Soitec is an international company based in France, that manufactures substrates used in the creation of semiconductors.. Soitec's semiconductor materials are used to manufacture chips which are used in smartphones, tablets, computers, IT servers, and data centres.