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The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...
Wafer bond characterization refers to the process of evaluating the quality and strength of a bond between two semiconductor wafers. The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws.
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .
Crystalline coatings (or crystalline mirrors [1]) are a type of thin-film optical interference coating that is made by merging monocrystalline multilayers deposited via processes such as molecular-beam epitaxy (MBE) and metalorganic vapour-phase epitaxy (MOVPE) with microfabrication techniques including direct bonding and selective etching.
Wafer bonding is a packaging technology for materials integration as well as for hermetic sealing and encapsulation. This method describes the process for all suitable bonding techniques that enable the contacting of two or more wafers.
Optical bonding improves the contrast ratio by reducing the amount of reflected light, thus improving viewability. This is especially important in outdoor applications, where direct sunlight can decrease viewability. [1] Fresnel reflections from the glass as well as the adhesive can degrade LCD viewability. Reflection is caused by an impedance ...
Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]