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Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...
The wafers can be cleaned using H 2 O 2 + H 2 SO 4 or oxygen plasma. The cleaned wafers are rinsed with DI water and dried at elevated temperature, e.g. 100 to 200 °C for 120 min. [17] The adhesion promoter with a specific thickness is deposited, i.e. spin-coated or contact printed on the wafer to improve the bonding strength.
Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces. High-strength bonding of semiconductors, metals, and dielectrics can be obtained even at room temperature ...
The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...
Image source: The Motley Fool. Applied Materials (NASDAQ: AMAT) Q3 2024 Earnings Call Aug 15, 2024, 4:30 p.m. ET. Contents: Prepared Remarks. Questions and Answers. Call Participants
ASM invests in new semiconductor fabrication technologies, like lithography, ion implantation, epitaxy, and wire bonding. In 1988, the company divests ASML Holding N.V., ASM Ion Implant, and it lists its Hong Kong–based activities as ASM Pacific Technology on the Hong Kong stock exchange in 1989.
It was a variation of the TSV process, and was later called SLID (solid liquid inter-diffusion) technology. [18] The term "through-silicon via" (TSV) was coined by Tru-Si Technologies researchers Sergey Savastiouk, O. Siniaguine, and E. Korczynski, who proposed a TSV method for a 3D wafer-level packaging (WLP) solution in 2000. [19]
While Taiwan Semiconductor is currently operating on all cylinders, the stock does come with risks. The company has been enjoying robust demand for AI chips and has increased capacity as a result.