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In-Circuit Test (ICT) is a widely used and cost-efficient [2] method for testing medium- to high-volume electronic printed circuit board assemblies (PCBAs). It has maintained its popularity over the years due to its ability to diagnose component-level faults and its operational speed.
A component selected for testing is a Unit Under Test (UUT). Operational Safety, Suitability, and Effectiveness (OSS&E) policy and instructions require consistency in the disciplined engineering process used to ensure that activities such as maintenance repairs and part substitutions do not degrade system or end-item baselined characteristics ...
Semiconductor ATE, named for testing semiconductor devices, can test a wide range of electronic devices and systems, from simple components (resistors, capacitors, and inductors) to integrated circuits (ICs), printed circuit boards (PCBs), and complex, completely assembled electronic systems.
A worst-case circuit analysis should be performed on all circuitry that is safety and financially critical. Worst-case circuit analysis is an analysis technique which, by accounting for component variability, determines the circuit performance under a worst-case scenario (under extreme environmental or operating conditions).
Electronic test equipment is used to create signals and capture responses from electronic devices under test (DUTs). In this way, the proper operation of the DUT can be proven or faults in the device can be traced. Use of electronic test equipment is essential to any serious work on electronics systems.
[1] [2] Printed wiring boards (PWBs) and electronic components and their solder joints are common cross sectioned samples. The features of interest to be analyzed in cross section can be nanometer-scale metal and dielectric layers in semiconductors [ 3 ] up to macroscopic features such as the amount of solder that has filled into a large, 0 ...
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