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A positive photoresist example, whose solubility would change by the photogenerated acid. The acid deprotects the tert-butoxycarbonyl (t-BOC), inducing the resist from alkali-insoluble to alkali-soluble. This was the first chemically amplified resist used in the semiconductor industry, which was invented by Ito, Willson, and Frechet in 1982. [5]
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The desired pattern is achieved by engraving with a laser or a diamond tool, or by chemical etching. If the cylinder is chemically etched, a resist (in the form of a negative image) is transferred to the cylinder before etching. The resist protects the non-image areas of the cylinder from the etchant. After etching, the resist is stripped off.
It is also resistant to acid, ferric chloride and other chemicals used to etch metals. The fundamental method of its use was first described in two US Patents, USP 2610120 [1] and USP 2670287, [2] assigned to the Eastman Kodak Company of Rochester, New York. These photo-resistant resins are formed from cinnamic acid esters, with the most ...
Polymers tend to be etched easily by oxygen, fluorine, chlorine and other reactive gases used in plasma etching. Use of a hardmask involves an additional deposition process, and hence additional cost. First, the hardmask material is deposited and etched into the required pattern using a standard photoresist process.
The resulting wafer is then "hard-baked" if a non-chemically amplified resist was used, typically at 120 to 180 °C [33] for 20 to 30 minutes. The hard bake solidifies the remaining photoresist, to make a more durable protecting layer in future ion implantation, wet chemical etching, or plasma etching.
A metal etching plate is a piece of sheet metal, usually copper, zinc, steel, or aluminium. The ground resists the acid or mordant which is used for etching, protecting areas of the metal plate. The ground resists the acid or mordant which is used for etching, protecting areas of the metal plate.
Etching processes use a resist, though in these typically the whole object is covered in the resist (called the "ground" in some contexts), which is then selectively removed from some parts. This is the case when a resist is used to prepare the copper substrate for champlevé enamels , where parts of the field are etched (with acid or ...