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  2. Transesophageal echocardiogram - Wikipedia

    en.wikipedia.org/wiki/Transesophageal_echocardiogram

    TEE is a semi-invasive procedure in that the probe must enter the body but does not require surgical (i.e., invasive) cutting for this procedure. Before inserting the probe, mild to moderate sedation is induced in the patient to ease the discomfort and to decrease the gag reflex .

  3. Test method - Wikipedia

    en.wikipedia.org/wiki/Test_method

    A test method is a method for a test in science or engineering, such as a physical test, chemical test, or statistical test. It is a definitive procedure that produces a test result. [ 1 ] In order to ensure accurate and relevant test results, a test method should be "explicit, unambiguous, and experimentally feasible.", [ 2 ] as well as ...

  4. Tensile testing - Wikipedia

    en.wikipedia.org/wiki/Tensile_testing

    Tensile testing on a coir composite. Specimen size is not to standard (Instron). Tensile testing, also known as tension testing, [1] is a fundamental materials science and engineering test in which a sample is subjected to a controlled tension until failure.

  5. Transthoracic echocardiogram - Wikipedia

    en.wikipedia.org/wiki/Transthoracic_echocardiogram

    A transthoracic echocardiogram (TTE) is the most common type of echocardiogram, which is a still or moving image of the internal parts of the heart using ultrasound.In this case, the probe (or ultrasonic transducer) is placed on the chest or abdomen of the subject to get various views of the heart.

  6. Bartlett's test - Wikipedia

    en.wikipedia.org/wiki/Bartlett's_test

    The test procedure due to M.S.E (Mean Square Error/Estimator) Bartlett test is represented here. This test procedure is based on the statistic whose sampling distribution is approximately a Chi-Square distribution with ( k − 1) degrees of freedom, where k is the number of random samples, which may vary in size and are each drawn from ...

  7. Wafer testing - Wikipedia

    en.wikipedia.org/wiki/Wafer_testing

    Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.

  8. List of IEC standards - Wikipedia

    en.wikipedia.org/wiki/List_of_IEC_standards

    IEC 60172 Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires; IEC 60183 Guidance for the selection of high-voltage A.C. cable systems; IEC 60188 High-pressure mercury vapour lamps – Performance specifications; IEC 60189 Low-frequency cables and wires with PVC insulation and PVC sheath

  9. Pensky–Martens closed-cup test - Wikipedia

    en.wikipedia.org/wiki/Pensky–Martens_closed-cup...

    It is standardized as ASTM D93, EN ISO 2719 and IP 34 [1] The United States Environmental Protection Agency (EPA) has also published Method 1010A: Test Methods for Flash Point by Pensky-Martens Closed Cup Tester, part of Test Methods for Evaluating Solid Waste, Physical/Chemical Methods, which references the ASTM standard series D93. The Pensky ...