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Fiber laser. A fiber laser (or fibre laser in Commonwealth English) is a laser in which the active gain medium is an optical fiber doped with rare-earth elements such as erbium, ytterbium, neodymium, dysprosium, praseodymium, thulium and holmium. They are related to doped fiber amplifiers, which provide light amplification without lasing.
Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.
Laser types with distinct laser lines are shown above the wavelength bar, while below are shown lasers that can emit in a wavelength range. The height of the lines and bars gives an indication of the maximal power/pulse energy commercially available, while the color codifies the type of laser material (see the figure description for details).
A fiber disk laser is a fiber laser with transverse delivery of the pump light. They are characterized by the pump beam not being parallel to the active core of the optical fiber (as in a double-clad fiber ), but directed to the coil of the fiber at an angle (usually, between 10 and 40 degrees). This allows use of the specific shape of the pump ...
A demonstrator Laser Weapons System was operating by 2017. [15] An Iron Beam battery is composed of an air defense radar, a command and control (C2) unit, and two HEL ( high-energy laser ) systems. It was intended to be mobile [ 16 ] and to be able to be used standalone, [ 4 ] but was later rendered non-mobile to address weight and power ...
Diagram of a simple VCSEL structure. The vertical-cavity surface-emitting laser (VCSEL / ˈ v ɪ k s əl /) is a type of semiconductor laser diode with laser beam emission perpendicular from the top surface, contrary to conventional edge-emitting semiconductor lasers (also called in-plane lasers) which emit from surfaces formed by cleaving the individual chip out of a wafer.
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