Search results
Results from the WOW.Com Content Network
A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
Figure 1: Example two-port network with symbol definitions. Notice the port condition is satisfied: the same current flows into each port as leaves that port.. In electronics, a two-port network (a kind of four-terminal network or quadripole) is an electrical network (i.e. a circuit) or device with two pairs of terminals to connect to external circuits.
Modern PCB design software typically provides "interactive routers"—the drafter selects a pad and clicks a few places to give the EDA tool an idea of where to go, and the EDA tool tries to place wires as close to that path as possible without violating design rule checking (DRC). Some more advanced interactive routers have "push and shove ...
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
A via fence consists of a row of via holes, that is, holes that pass through the substrate and are metallised on the inside to connect to pads on the top and bottom of the substrate. In a stripline format both the top and bottom of the dielectric sheet are covered with a metal ground plane so any via holes are automatically grounded at both ends.
These failures result from the thermomechanical stresses caused by coefficient of thermal expansion (CTE) mismatch, in the PCB thickness direction, between the metallization in a microvia structure and the dielectric materials surrounding the metal. The following paragraph highlights some of the microvia reliability research.
For instance, in the figure example (c), if the poles 2 and 4 are each split into two poles each then the circuit can be described as a 3-port. However, it is also possible to connect generators to pole pairs (1, 3) , (1, 4) , and (3, 2) making 4 C 2 = 6 generators in all and the circuit has to be treated as a 6-port.