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A probe card or DUT board is a printed circuit board (PCB), and is the interface between the integrated circuit and a test head, which in turn attaches to automatic test equipment (ATE) (or "tester"). [2] Typically, the probe card is mechanically docked to a Wafer testing prober and electrically connected to the ATE . Its purpose is to provide ...
Semiconductor ATE, named for testing semiconductor devices, can test a wide range of electronic devices and systems, from simple components (resistors, capacitors, and inductors) to integrated circuits (ICs), printed circuit boards (PCBs), and complex, completely assembled electronic systems. For this purpose, probe cards are used. ATE systems ...
Not to be confused with Printed electronics. "PCB" redirects here. For other uses, see PCB (disambiguation). "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the ...
A coupon or test coupon is a printed circuit board (PCB) used to test the quality of a printed wiring board (PWB) fabrication process. Test coupons are fabricated on the same panel as the PWBs, typically at the edges. Coupons are then inspected to ensure proper layer alignment, electrical connectivity, and cross sectioned to inspect internal ...
A common form of in-circuit testing uses a bed-of-nails tester.This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing.
the probe card may be damaged from repeated contact, or become contaminated with debris created by contact with the wafer [2] the probe will act as a circuit and affect the results of the test. For this reason, the tests performed at wafer sort cannot always be identical and as extensive as those performed at the final device test after ...
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