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  2. Integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit

    A microscope image of an integrated circuit die used to control LCDs.The pinouts are the dark circles surrounding the integrated circuit.. An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors.

  3. List of integrated circuit packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_integrated_circuit...

    Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm. Quad flat package (QFP): various sizes, with pins on all four sides. Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins.

  4. Semiconductor memory - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_memory

    In a semiconductor memory chip, each bit of binary data is stored in a tiny circuit called a memory cell consisting of one to several transistors. The memory cells are laid out in rectangular arrays on the surface of the chip. The 1-bit memory cells are grouped in small units called words which are accessed together as a single memory address.

  5. Dynamic random-access memory - Wikipedia

    en.wikipedia.org/wiki/Dynamic_random-access_memory

    Dynamic random-access memory (dynamic RAM or DRAM) is a type of random-access semiconductor memory that stores each bit of data in a memory cell, usually consisting of a tiny capacitor and a transistor, both typically based on metal–oxide–semiconductor (MOS) technology. While most DRAM memory cell designs use a capacitor and transistor ...

  6. Semiconductor package - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_package

    A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external ...

  7. Thin small outline package - Wikipedia

    en.wikipedia.org/wiki/Thin_small_outline_package

    An outline drawing of a Type I TSOP with 32 leads. Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being ...

  8. China chip stocks surge on government equipment list - AOL

    www.aol.com/news/china-chip-stocks-surge...

    Resolution determines how small the features on a semiconductor chip can be made. Smaller resolutions allow for more advanced, powerful chips. ... Alonso and Acuña power Mets past Nationals 10-1 ...

  9. Computer data storage - Wikipedia

    en.wikipedia.org/wiki/Computer_data_storage

    Computer data storage or digital data storage is a technology consisting of computer components and recording media that are used to retain digital data. It is a core function and fundamental component of computers. [1]: 15–16. The central processing unit (CPU) of a computer is what manipulates data by performing computations.

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