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Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...
Included are two DIL chips, a plastic holder for the chips, and a IC extractor for the DIL chips. An IC extractor is a tool for safely and quickly removing integrated circuits (ICs) from their sockets. The main purpose of using this tool is to avoid bending the socket pins [1] and to avoid damage through electrostatic discharge (ESD).
Decapping is usually carried out by chemical etching of the covering, [2] [10] laser cutting, laser evaporation of the covering, [11] plasma etching [10] or mechanical removal of the cover using a milling machine, saw blade, [12] using hot air [13] or by desoldering and cutting. [14] The process can be either destructive or non-destructive of ...
Junction damage manifesting as reverse-bias leakage increases to the point of shorting. Metallisation and polysilicon burnout, where damage is limited to metal and polysilicon interconnects, thin film resistors and diffused resistors. Charge injection, where hot carriers generated by avalanche breakdown are injected into the oxide layer.
During this process, a wafer with up to thousands of circuits is cut into rectangular pieces, each called a die. In between those functional parts of the circuits, a thin non-functional spacing is foreseen where a saw can safely cut the wafer without damaging the circuits. This spacing is called the scribe line or saw street.
Removing the housing from a chip is typically a chemical process called decapping - a chip is so small and the parts are so microscopic that opening a housing (also named delidding) with tools such as saws, sanders or dremels could damage the chip in such a way that a die shot is no longer or less useful. [3]
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If the etch is intended to make a cavity in a material, the depth of the cavity may be controlled approximately using the etching time and the known etch rate. More often, though, etching must entirely remove the top layer of a multilayer structure, without damaging the underlying or masking layers.