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In a radio receiver circuit, the RF front end, short for radio frequency front end, is a generic term for all the circuitry between a receiver's antenna input up to and including the mixer stage. [1] It consists of all the components in the receiver that process the signal at the original incoming radio frequency (RF), before it is converted to ...
The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1] FEOL generally covers everything up to (but not including) the deposition of metal interconnect layers.
This mini environment is within an EFEM (equipment front end module) [8] which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. [ 3 ]
Atheros Intellon 1200 AFE-Chip as companion for an INT 5500 PowerLine-IC. An analog front-end (AFE or analog front-end controller AFEC) is a set of analog signal conditioning circuitry that uses sensitive analog amplifiers, often operational amplifiers, filters, and sometimes application-specific integrated circuits for sensors, radio receivers, and other circuits to provide a configurable and ...
Referred to respectively as the wafer fab equipment [2] or wafer front end [3] (equipment) market, both using the acronym WFE, the market is that of the manufacturers of the machines which in turn manufacture semiconductors.
This mini environment is within an EFEM (equipment front end module) [14] which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. [ 9 ]
front end of line (FEoL) – initial wafer processing steps up to (but not including) metal interconnect (see also back end of line, far back end of line, post-fab) heterogeneous integration – combining different types of integrated circuitry into a single device; differences may be in fabrication process, technology node, substrate, or function
The second module, called the "data centric module", is made up of 1,536 Intel Sapphire Rapids CPUs, [7] and will be capable of 8.97 LINPACK petaflops. [8] These two computing modules will be complemented by a "front-end & service module", and backed by two storage systems; 5 PB of high IOPS storage with 1 TB/s bandwidth and 100 PB of high ...