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  2. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current.

  3. Electrodeposition - Wikipedia

    en.wikipedia.org/wiki/Electrodeposition

    Electrodeposition may refer to: Electroplating , a process that uses electric current to reduce dissolved metal cations so that they form a coherent metal coating on an electrode Electrophoretic deposition , a term for a broad range of industrial processes which includes electrocoating, e-coating, cathodic electrodeposition, anodic ...

  4. Electrophoretic deposition - Wikipedia

    en.wikipedia.org/wiki/Electrophoretic_deposition

    Electrophoretic Deposition Process. Electrophoretic deposition (EPD), is a term for a broad range of industrial processes which includes electrocoating, cathodic electrodeposition, anodic electrodeposition, and electrophoretic coating, or electrophoretic painting.

  5. Electrometallurgy - Wikipedia

    en.wikipedia.org/wiki/Electrometallurgy

    Metal powder production by electrodeposition is included in this category, or sometimes electrowinning, or a separate category depending on application. [2] Electroplating, the deposition of a layer of one metal on another [2] Electroforming, the manufacture of, usually thin, metal parts through electroplating [2]

  6. Electrowinning - Wikipedia

    en.wikipedia.org/wiki/Electrowinning

    In electrowinning, an electrical current is passed from an inert anode through a leach solution containing the dissolved metal ions so that the metal is recovered as it is reduced and deposited in an electroplating process onto the cathode. In electrorefining, the anode consists of the impure metal (e.g., copper) to be refined. The impure ...

  7. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Electroless deposition is advantageous in comparison to PVD, CVD, and electroplating deposition methods because it can be performed at ambient conditions. [2] [6] The plating method for Ni-P, Ni-Au, Ni-B, and Cu baths are distinct; however, the processes involve the same approach. The electroless deposition process is defined by four steps: [2 ...

  8. Electrogravimetry - Wikipedia

    en.wikipedia.org/wiki/Electrogravimetry

    In this process, the analyte solution is electrolyzed. Electrochemical reduction causes the analyte to be deposited on the cathode. The mass of the cathode is determined before and after the experiment, and the difference is used to calculate the mass of analyte in the original solution.

  9. Localized pulsed electrodeposition - Wikipedia

    en.wikipedia.org/wiki/Localized_pulsed_electro...

    When the nozzle approaches the substrate, the meniscus is formed at the nozzle tip, and functions as a confined electrodeposition bath. A two-electrode configuration was employed for the L-PED process, consists of a working electrode (the substrate) and a counter electrode (a metal wire which is inserted within the micropipette).