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Plasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops, automotive ...
PECVD machine at LAAS technological facility in Toulouse, France. Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases.
Spherical Tokamak for Energy Production (STEP) is a spherical tokamak fusion plant concept proposed by the United Kingdom Atomic Energy Authority (UKAEA) and funded by the UK government. [ 1 ] [ 2 ] [ 3 ] The project is a proposed DEMO -class successor device to the ITER tokamak proof-of-concept of a fusion plant, the most advanced tokamak ...
Plasma torch. A plasma torch cutter. A plasma torch (also known as a plasma arc, plasma gun, plasma cutter, or plasmatron) is a device for generating a directed flow of plasma. [1][2][3] The plasma jet can be used for applications including plasma cutting, plasma arc welding, plasma spraying, and plasma gasification for waste disposal. [4]
Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer ...
A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...
Toroidal machines can be axially symmetric, like the tokamak and the reversed field pinch (RFP), or asymmetric, like the stellarator.The additional degree of freedom gained by giving up toroidal symmetry might ultimately be usable to produce better confinement, but the cost is complexity in the engineering, the theory, and the experimental diagnostics.
Semiconductor device fabrication. Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM). It is a multiple-step photolithographic and physico-chemical process (with steps such as ...
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