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  2. Plasma cutting - Wikipedia

    en.wikipedia.org/wiki/Plasma_cutting

    Plasma cutting. Plasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops ...

  3. Spherical Tokamak for Energy Production - Wikipedia

    en.wikipedia.org/wiki/Spherical_Tokamak_for...

    Spherical Tokamak for Energy Production (STEP) is a spherical tokamak fusion plant concept proposed by the United Kingdom Atomic Energy Authority (UKAEA) and funded by the UK government. [ 1 ] [ 2 ] [ 3 ] The project is a proposed DEMO -class successor device to the ITER tokamak proof-of-concept of a fusion plant, the most advanced tokamak ...

  4. Plasma-enhanced chemical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Plasma-enhanced_chemical...

    PECVD machine at LAAS technological facility in Toulouse, France. Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases.

  5. Plasma etching - Wikipedia

    en.wikipedia.org/wiki/Plasma_etching

    A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...

  6. Dry etching - Wikipedia

    en.wikipedia.org/wiki/Dry_etching

    Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.

  7. Talk:Plasma cutting - Wikipedia

    en.wikipedia.org/wiki/Talk:Plasma_cutting

    2 "Plasma cutters working near sensitive electronics, such as CNC hardware or computers, use the contact start method. The nozzle and electrode are in contact. The nozzle is the cathode, and the electrode is the anode. When the plasma gas begins to flow, the nozzle is blown forward."

  8. Plasma cleaning - Wikipedia

    en.wikipedia.org/wiki/Plasma_cleaning

    Plasma cleaning. Fig. 1. The surface of a MEMS device is cleaned with bright, blue oxygen plasma in a plasma etcher to rid it of carbon contaminants. (100mTorr, 50W RF) Plasma cleaning is the removal of impurities and contaminants from surfaces through the use of an energetic plasma or dielectric barrier discharge (DBD) plasma created from ...

  9. Electrophoretic deposition - Wikipedia

    en.wikipedia.org/wiki/Electrophoretic_deposition

    Electrophoretic deposition (EPD), is a term for a broad range of industrial processes which includes electrocoating, cathodic electrodeposition, anodic electrodeposition, and electrophoretic coating, or electrophoretic painting. A characteristic feature of this process is that colloidal particles suspended in a liquid medium migrate under the ...

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