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The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings.
In each generation, the highest-performing Core i7 processors use the same socket and QPI-based architecture as the medium-end Xeon processors of that generation, while lower-performing Core i7 processors use the same socket and PCIe/DMI/FDI architecture as the Core i5. "Core i7" is a successor to the Intel Core 2 brand.
The vast majority of Intel server chips of the Xeon E3, Xeon E5, and Xeon E7 product lines support VT-d. The first—and least powerful—Xeon to support VT-d was the E5502 launched Q1'09 with two cores at 1.86 GHz on a 45 nm process. [2]
Lakefield: mobile-only, Intel's first hybrid processor, released in June 2020. Sunny Cove is used in the singular performance core (P-core) of Lakefield processors. [12] AVX and more advanced instruction sets are disabled due to the E-core not supporting them.
Intel Core: Txxxx Lxxxx Uxxxx Yonah: 2006–2008 1.06 GHz – 2.33 GHz Socket M: 65 nm 5.5 W – 49 W 1 or 2 533 MHz, 667 MHz 64 KiB per core 2 MiB N/A Intel Core 2: Uxxxx Lxxxx Exxxx Txxxx P7xxx Xxxxx Qxxxx QXxxxx Allendale Conroe Merom Penryn Kentsfield Wolfdale Yorkfield: 2006–2011 1.06 GHz – 3.33 GHz Socket 775 Socket M Socket P Socket ...
Core i5 and i7 except the Core i5-4410E, i5-4402EC, i7-4700EC, and i7-4702EC support Turbo Boost 2.0. Haswell-ULT and ULX: Platform Controller Hub (PCH) integrated into the CPU package, slightly reducing the amount of space used on motherboards.
Tick–tock was a production model adopted in 2007 by chip manufacturer Intel.Under this model, every new process technology was first used to manufacture a die shrink of a proven microarchitecture (tick), followed by a new microarchitecture on the now-proven process (tock).
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