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For brazing titanium alloys. Available as amorphous foil. 17: Zr 83: Zr 56 V 28 Ti 16: 1193/1250 [5] – For brazing titanium alloys. Available as amorphous foil. 16: Zr 56 V 28: Ag 57 Cu 38 Ti 5: active 775/790 [5] – Active alloy. Can be used for brazing ceramics, e.g. silicon nitride. Titanium forms an interfacial layer with Si 3 N 4 ...
Silver brazing may cause defects in certain alloys, e.g. stress-induced inter-granular cracking in copper-nickel. One special silver brazing method is called pinbrazing or pin brazing. It has been developed especially for connecting cables to railway track or for cathodic protection installations. The method uses a silver- and flux-containing ...
Heusler alloy, a range of ferromagnetic alloys (66% copper, cobalt, iron, manganese, nickel or palladium) High-entropy alloys; Intermetallic compounds; List of brazing alloys; Pot metal; inexpensive casting metal of non-specific composition
CuSil is a tradename for an alloy of 72% silver and 28% copper (± 1%) marketed by Morgan Advanced Materials. It is a eutectic alloy primarily used for vacuum brazing . [ 1 ] CuSil should not be confused with the similarly named Cusil-ABA, which has a different composition (Ag – 63.0%, Cu – 35.25%, Ti – 1.75%)
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Cadmium and zinc are the worst common offenders. Silver, a common component of brazing alloys, can be problematic at higher temperatures and lower pressures. A silver-copper eutectic, named e.g. Cusil, is recommended. A superior alternative is a copper-silver-tin alloy called Cusiltin. Copper-silver-phosphorus alloys, e.g. Sil-Fos, are also ...
Brazing with silver-based brazing alloys may require first electroplating the Glidcop part with either copper or nickel. [6] The copper plating can be done with a copper cyanide solution; other solutions may not work. Gold-based brazing alloys like 3565 AuCu and 5050 AuCu, can be used in a dry hydrogen atmosphere. [7] [8]
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]