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2. File:Santa hat.svg - Wikipedia

   en.wikipedia.org/wiki/File:Santa_hat.svg

   English: An SVG drawing of a Santa hat. Originally from OpenClipArt, which gives all drawings a Public Domain licence. ... image/svg+xml. checksum ...

3. File:Make America Great Again (MAGA) hat.svg - Wikipedia

   en.wikipedia.org/wiki/File:Make_America_Great...

   Main page; Contents; Current events; Random article; About Wikipedia; Contact us

4. File:Graduation hat.svg - Wikipedia

   en.wikipedia.org/wiki/File:Graduation_hat.svg

   Original file (SVG file, nominally 661 × 278 pixels, file size: 2 KB) This is a file from the Wikimedia Commons . Information from its description page there is shown below.

5. File:Education - Grad Hat.svg - Wikipedia

   en.wikipedia.org/wiki/File:Education_-_Grad_Hat.svg

   Original file (SVG file, nominally 606 × 606 pixels, file size: 6 KB) This is a file from the Wikimedia Commons . Information from its description page there is shown below.

6. File:Christian cross.svg - Wikipedia

   en.wikipedia.org/wiki/File:Christian_cross.svg

   Original file (SVG file, nominally 404 × 564 pixels, file size: 190 bytes) This is a file from the Wikimedia Commons . Information from its description page there is shown below.

7. Portal:Painting - Wikipedia

   en.wikipedia.org/wiki/Portal:Painting

   Mona Lisa (1503–1517) by Leonardo da Vinci is one of the world's most recognizable paintings.. Painting is a visual art, which is characterized by the practice of applying paint, pigment, color or other medium to a solid surface (called "matrix" or "support").

8. Smorgasbord - Wikipedia

   en.wikipedia.org/wiki/Smorgasbord

   Warm dishes include Swedish meatballs (köttbullar), small fried hot-dog-type sausages , roasted pork ribs (revbensspjäll), pork sausages , potato sausages (potatiskorv), and Janssons frestelse (literally "Jansson's Temptation"; a warm potato casserole), matchstick potatoes layered with cream, onion and sprats.

9. Three-dimensional integrated circuit - Wikipedia

   en.wikipedia.org/wiki/Three-dimensional...

   There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]