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Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw ) [ 2 ] or laser cutting .
The cutting surface of the die is the edge of hardened steel strips, known as steel rule. These steel rules are usually located using saw or laser-cut grooves in plywood. The mating die can be a flat piece of hardwood or steel, a male shape that matches the workpiece profile, or it can have a matching groove that allows the rule to nest into ...
Rotary die cutting is die cutting using a cylindrical die on a rotary press and may be known as a rotary die cutter or RDC. A long sheet or web of material will be fed through the press into an area known as a "station" which holds a rotary tool that will cut out shapes, make perforations or creases, or even cut the sheet or web into smaller parts.
where t is the depth of cut, P is the laser beam power, v is the cutting velocity, and d is the laser beam spot diameter. [5] The depth of the cut is also influenced by the workpiece material. The material's reflectivity, density, specific heat, and melting point temperature all contribute to the lasers ability to cut the workpiece.
The U.S. Navy unveiled a photo of a warship's high-powered laser weapon in an annual report released last month. The image published in the Office of the Director, Operational Test & Evaluation's ...
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