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A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
A vacuum insulated panel (VIP) is a form of thermal insulation consisting of a gas-tight enclosure surrounding a rigid core, from which the air has been evacuated. It is used in building construction , refrigeration units, and insulated shipping containers to provide better insulation performance than conventional insulation materials.
Rigid panel insulation, also known as continuous insulation [13] can be made from foam plastics such as polyisocyanurate or polystyrene, or from fibrous materials such as fiberglass, rock and slag wool. Rigid panel continuous insulation is often used to provide a thermal break in the building envelope, thus reducing thermal bridging.
Interfacial thermal resistance, also known as thermal boundary resistance, or Kapitza resistance, is a measure of resistance to thermal flow at the interface between two materials. While these terms may be used interchangeably, Kapitza resistance technically refers to an atomically perfect, flat interface whereas thermal boundary resistance is ...
A multi-family residential building under construction with rigid panel exterior insulating sheathing. Rigid panel insulation, also referred to as continuous insulation, [1] can be made from foam plastics such as polyurethane (PUR), polyisocyanurate (PIR), and polystyrene, or from fibrous materials such as fiberglass, rock and slag wool.
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