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  2. Rework (electronics) - Wikipedia

    en.wikipedia.org/wiki/Rework_(electronics)

    Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

  3. Reflow soldering - Wikipedia

    en.wikipedia.org/wiki/Reflow_soldering

    Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

  4. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

  5. Reflow oven - Wikipedia

    en.wikipedia.org/wiki/Reflow_oven

    A convection reflow oven. A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. For prototyping or hobbyist use PCBs can be placed in a ...

  6. Hot air solder leveling - Wikipedia

    en.wikipedia.org/wiki/Hot_air_solder_leveling

    HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives.

  7. Flip chip - Wikipedia

    en.wikipedia.org/wiki/Flip_chip

    A solder ball is deposited on each of the pads, in a process called wafer bumping; Chips are cut. Chips are flipped and positioned so that the solder balls are facing the connectors on the external circuitry. Solder balls are then remelted (typically using hot air reflow).

  8. 4 killed serving warrant with U.S. marshals task force in ...

    www.aol.com/news/numerous-officers-struck...

    A marshal and two local officers working with the fugitive task force were killed in the gunfire around 1:30 p.m. Gov. Roy Cooper said that “two state Department of Adult Correction officers ...

  9. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...