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2. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   For example, tin-lead solder [5] attaches very well to copper metal, but poorly to its oxides, which form quickly at soldering temperatures. By preventing the formation of metal oxides, flux enables the solder to adhere to the clean metal surface, rather than forming beads, as it would on an oxidized surface.

3. Solder - Wikipedia

   en.wikipedia.org/wiki/Solder

   Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.

4. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   A silversmith hard soldering of silver rings using flux and silver solder wire. "Hard soldering" or "silver soldering" is used to join precious and semi-precious metals such as gold, silver, brass, and copper. The solder is usually described as easy, medium, or hard in reference to its melting temperature, not the strength of the joint. Extra ...

5. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties.

6. List of brazing alloys - Wikipedia

   en.wikipedia.org/wiki/List_of_brazing_alloys

   BAg-8a, Lithobraze 720, Lithobraze BT, Silver Braze 72a High fluidity. For ferrous and nonferrous alloys. Especially suitable for thin stainless steel. For general purpose fluxless furnace brazing of stainless steels. Requires hydrogen or inert atmosphere. [50] 28: 71.7: Li 0.3: Ag 92.5 Cu 7.3 Li 0.2: Ag–Cu–Li 760/890 [46] – BAg-19 ...

7. Tin-silver-copper - Wikipedia

   en.wikipedia.org/wiki/Tin-silver-copper

   Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]