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  2. Rogers Corporation - Wikipedia

    en.wikipedia.org/wiki/Rogers_Corporation

    Rogers offers liquid cooling materials designed to dissipate large amounts of heat, and provide thermal management of high-power laser diodes and other heat-generating optical devices. The cooling structures are copper foil channels bonded into a tight block, with aluminum-nitride (AlN) isolation layers added for extra performance.

  3. CutePDF - Wikipedia

    en.wikipedia.org/wiki/CutePDF

    CutePDF is a proprietary Portable Document Format converter and editor for Microsoft Windows developed by Acro Software. [1] [2] CutePDF Writer can create PDF files, [3] and CutePDF Form Filler can edit simple PDF forms so that they can be sent without using more expensive PDF authoring software.

  4. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    The resist material protects the copper from dissolution into the etching solution. The etched board is then cleaned. A PCB design can be mass-reproduced in a way similar to the way photographs can be mass-duplicated from film negatives using a photographic printer. FR-4 glass epoxy is the most common insulating substrate.

  5. CPU card - Wikipedia

    en.wikipedia.org/wiki/CPU_card

    Schneider CPU board from 1988. A CPU card is a printed circuit board (PCB) that contains the central processing unit (CPU) of a computer. CPU cards are specified by CPU clock frequency and bus type as well as other features and applications built into the card.

  6. Power electronic substrate - Wikipedia

    en.wikipedia.org/wiki/Power_electronic_substrate

    The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand vo

  7. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...

  8. FR-2 - Wikipedia

    en.wikipedia.org/wiki/FR-2

    FR-2 (Flame Resistant 2) is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards. Its main properties are similar to NEMA grade XXXP (MIL-P-3115) material, and can be substituted for the latter in many ...

  9. Eurocard (printed circuit board) - Wikipedia

    en.wikipedia.org/wiki/Eurocard_(printed_circuit...

    Eurocard is an IEEE standard format for printed circuit board (PCB) cards that can be plugged together into a standard chassis which, in turn, can be mounted in a 19-inch rack. The chassis consists of a series of slotted card guides on the top and bottom, into which the cards are slid so they stand on end, like books on a shelf.

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