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Stress testing, in general, should put computer hardware under exaggerated levels of stress in order to ensure stability when used in a normal environment. These can include extremes of workload, type of task, memory use, thermal load (heat), clock speed, or voltages. Memory and CPU are two components that are commonly stress tested in this way.
To help address this some benchmarks, like SPECpower, include measurements at a series of load levels. [23] The efficiency of some electrical components, such as voltage regulators, decreases with increasing temperature, so the power used may increase with temperature. Power supplies, motherboards, and some video cards are some of the ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
htop displaying a significant computing load (top right: Load average:) In UNIX computing, the system load is a measure of the amount of computational work that a computer system performs. The load average represents the average system load over a period of time. It conventionally appears in the form of three numbers which represent the system ...
Processor manufacturers usually release two power consumption numbers for a CPU: typical thermal power, which is measured under normal load (for instance, AMD's average CPU power) maximum thermal power, which is measured under a worst-case load; For example, the Pentium 4 2.8 GHz has a 68.4 W typical thermal power and 85 W maximum thermal power.
1×10 −1: multiplication of two 10-digit numbers by a 1940s electromechanical desk calculator [1] 3×10 −1: multiplication on Zuse Z3 and Z4, first programmable digital computers, 1941 and 1945 respectively; 5×10 −1: computing power of the average human mental calculation [clarification needed] for multiplication using pen and paper
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
The equipment under test must be monitored so that if the equipment fails under test, the failure is detected. Monitoring is typically performed with thermocouple sensors, vibration accelerometers, multimeters and data loggers. Common causes of failures during HALT are poor product design, workmanship, and poor manufacturing.