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Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
Both wafers and reticles can be handled by SMIF pods in a semiconductor fabrication environment. Used in lithographic tools, reticles or photomasks contain the image that is exposed on a coated wafer in one processing step of a complete integrated semiconductor manufacturing cycle. Because reticles are linked so directly with wafer processing ...
JST manufactures numerous series (families) and pitches (pin-to-pin distance) of connectors. [2] [3] JST connectors are used in many types of products, and commonly used by electronics hobbyists and consumer products for rechargeable battery packs, battery balancers, battery eliminator circuits, 3D printers, and radio controlled servos. [4]
Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. [2] Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects).
With 200 mm wafers manual handling of wafer cassettes becomes risky as they are heavier. [44] In the 1970s, several companies migrated their semiconductor manufacturing technology from bipolar to MOSFET technology. Semiconductor manufacturing equipment has been considered costly since 1978. [45]
Key benefits of wafer marking equipment include: Traceability and Quality Control: By marking wafers with unique identifiers such as lot numbers, timestamps, or batch information, manufacturers can trace wafers across different production phases. This facilitates real-time monitoring, enabling quick identification of deviations from standard ...
Companies that develop, manufacture and service equipment for semiconductor fabrication. Subcategories. This category has only the following subcategory. H. Hitachi ...
DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage ...
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