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  2. Evaporation (deposition) - Wikipedia

    en.wikipedia.org/wiki/Evaporation_(deposition)

    Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film.

  3. Vapor–liquid–solid method - Wikipedia

    en.wikipedia.org/wiki/Vapor–liquid–solid_method

    A thin (~1–10 nm) Au film is deposited onto a silicon (Si) wafer substrate by sputter deposition or thermal evaporation. The wafer is annealed at temperatures higher than the Au-Si eutectic point, creating Au-Si alloy droplets on the wafer surface (the thicker the Au film, the larger the droplets).

  4. Physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Physical_vapor_deposition

    Thermal laser epitaxy: a continuous-wave laser evaporates individual, free-standing elemental sources which then condense upon a substrate. Sputter deposition: a glow plasma discharge (usually localized around the "target" by a magnet) bombards the material sputtering some away as a vapor for subsequent deposition.

  5. Chemical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Chemical_vapor_deposition

    Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films .

  6. Thermal laser epitaxy - Wikipedia

    en.wikipedia.org/wiki/Thermal_Laser_Epitaxy

    Thermal laser epitaxy (TLE) is a physical vapor deposition technique that utilizes irradiation from continuous-wave lasers to heat sources locally for growing films on a substrate. [ 1 ] [ 2 ] This technique can be performed under ultra-high vacuum pressure or in the presence of a background atmosphere, such as ozone , to deposit oxide films.

  7. Vacuum deposition - Wikipedia

    en.wikipedia.org/wiki/Vacuum_deposition

    Vacuum deposition is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum ).

  8. Electron-beam physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Electron-beam_physical...

    Thin-film deposition is a process applied in the semiconductor industry to grow electronic materials, in the aerospace industry to form thermal and chemical barrier coatings to protect surfaces against corrosive environments, in optics to impart the desired reflective and transmissive properties to a substrate and elsewhere in industry to modify surfaces to have a variety of desired properties.

  9. Pulsed laser deposition - Wikipedia

    en.wikipedia.org/wiki/Pulsed_laser_deposition

    A plume ejected from a SrRuO 3 target during pulsed laser deposition. One possible configuration of a PLD deposition chamber. Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited.