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Concrete products are codenamed "Llano": List of AMD accelerated processing units. Llano AMD Fusion ( K10 cores + Redwood -class GPU) (launch Q2 2011, this is the first AMD APU) uses Socket FM1 Bulldozer architecture; Bulldozer, Piledriver, Steamroller, Excavator (2011–2017)
Bundled with AMD Wraith Stealth; The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
Socket SP3 is a system in a package socket - that means most features required to make the system fully functional (such as memory, PCI Express, SATA controllers etc.) are fully integrated into the processor package, eliminating the need for a chipset to be placed on a motherboard. Variants for desktop platforms (as said below) are, eventually ...
A CPU socket is made of plastic, and often comes with a lever or latch, and with metal contacts for each of the pins or lands on the CPU. Many packages are keyed to ensure the proper insertion of the CPU. CPUs with a PGA (pin grid array) package are inserted into the socket and
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. [4] [5] [6] It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. [7]
A partnership between AMD and Alpha Processor Inc. developed HyperTransport, a point-to-point interconnect standard which was turned over to an industry standards body for finalization. [286] It is now used in modern motherboards that are compatible with AMD processors.
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